SnBi合金_低温焊接底填胶_39-ICH09/39-ICH08
SnBi合金低温焊接底填胶39-ICH08/39-ICH09_适用于低温焊接封装。该胶水为平衡固化剂。有可能获得低CTE和低温度固化的特性。
ASEC低温焊接底填胶39-ICH09功能：
用于散热器包装
·该Underfill胶水兼顾了流动性和散热性能。2.2瓦/米/千
·低CTE提供良好的热冲击性能
ASEC_SnBi合金低温焊接专用底填胶39-ICH08特点：
Liquid state
Property Typical Value Test Condition
Chemical Epoxy (Black)
Specific Gravity 1.4 @25度
Thixotropic index 1.0 12s-1/120s-1
Viscosity 4.200 mPa·s Cone plate type, 120s-1
Cured state
Property Typical Value Test Condition
Tensile Modulus 4.6 Gpa 25度, DMA
Tg 120度 DMS
CTE α1/α2 39/105 ppm/度 TMA
Tensile shear strength 16 Mpa JIS K 6850
Volume resistivity 2.28 x 1015Ω·cm JIS K 6911
Surface resistivity 9.7 x 1015Ω JIS K 6911
Dielectric constant 3.08 1.0GHz
3.05 2.45GHz
Dielectric loss tangent 0.015 1.0GHz
0.015 2.45GHz
ASEC 39-ICH09低温焊接底填胶特点：
Liquid state
Property Typical Value Test Condition
Chemical Epoxy
Viscosity 29,500 mPa·s @25degC B type Viscometer
Filler Size 10μm Maximum size
Flowability 10mm GAP50μm Glass/Glass 100x60sec
Cured state
Property Typical Value Test Condition
Storage Modulus 18 Gpa 25度
Tg 110度
CTE α1/α2 15/58 ppm/度
Moisture Absorption 0.5% PCT 2atm, 20hr
Thermal conductivity 2.2 W/m/K
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