晶圆减薄（晶圆抛光）GDM300_Hapoin衡鹏
晶圆减薄（晶圆抛光）GDM300特长：
·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness.
·With 2 head polishing stage, throughput is almost double compared with 1 polish head system.
·Built in edge trimming system is available as an option for thin wafer process.
·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process.
·Less than Ra1A ultra luminance, ultra mirror surface is possible.
采用全自动系统，从后磨到贴装的连续过程，可研磨至25um厚度。
2个磨头阶段，产量几乎是1个磨头系统的两倍。
内置修边系统可作为薄型晶圆加工的选择。
双指标体系，抛光阶段和研磨阶段完全分离，满足TSV和MEMS工艺所需的清洁。
超亮度小于Ra1A，可超镜面。
了解更多：http://www.hapoin.com/Wafer_Grinding/
晶圆减薄（晶圆抛光）GDM300相关产品：
Hapoin衡鹏供应
晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/Wafer Grinding GNX200BP
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