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广东USP-1515MG,USP-1515M4批发，晶圆切割，uv

产品价格：	电询/人民币
最后更新：	2012-11-05 09:41:43
产品产地：	新友维
发货地：	15377723326 (发货期：当天内发货)
供应数量：	不限
有效期：	长期有效
最少起订：	1
浏览次数：	792

公司基本资料信息

东莞市新友维粘胶制品有限公司
王桂云小姐销售主管
会员[试用会员产品]
邮件uwtape@uwtape.com
手机15377723326
电话
传真
地址东莞市长安镇富宁街9号

产品详细说明

晶圆切割胶带- Pressure Sensitive Series -

Part Number :
F - 90
T - 80
T - 120
GE - 200

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Various product line
● standard type (AD series)
● high-performance to difficult-to-adhere workpiece (ＧＤ series)
● excellent stability against elapsed deterioration (Ｔ series)
● high-performance to laser-dicing (F-90)
● Easy pick-up with excellent expandability

Specification

Recommended Works	Part Number	Base Film	Color	Thickness (μm)	Adhesion Thickness (μm)	Adhesive Strength (N/20mm)	Probe Tack (N/20mm2)	Feature
Si GaAs Other Semiconductor	F-90MW	PO	MW	90	10	1	1	PVC-free type
	T-80MW	PVC		80		0.8	0.7	Excellent temporal stability
	T-80HW			80		1.7	1
	T-120HW			120		1.7	1
Thick Workpiece	20GE-200		LB	200		2.7	2.9	For thick workpiece

＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
＊Separator thickness is not included.

晶圆切割胶带- UV Series -

Part Number :
UDV - 80J / UDV - 100J / UHP - 110B
UHP - 0805MC / UHP - 1005M3
UHP - 110M3 / UHP - 1025M3
UHP - 1510M3 / UHP - 1525M3
USP - 1515M4 / USP - 1515MG
UDT - 1025MC / UDT - 1325D
UDT - 1915MC

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.
Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Excellent control to back-side chipping and chip fly-off.
● Excellent adhesiveness.
● Smooth peeling by UV.
● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

Recommended Work I	Si GaAs Other Semi conductor
Part Number	UDV- 80J	UDV- 100J	UHP- 110B	UHP- 0805MC	UHP- 1005M3	UHP- 110M3
基材	PVC		PO
颜色	T		MW
总厚度 (μm)	80	100	110	85	105	110
黏着力 (μm)	10			5		10
Adhesive Strength (N/20mm)	3.8(0.2)	3.8(0.2)	2.9(0.2)	5.0(0.2)	5.0(0.2)	7.6(0.2)
Probe Tack (N/20mm2)	2.1(0.05)	2.1(0.05)	2.7(0.05)	1.7(0.05)	2.7(0.05)	3.9(0.05)
特性	Easy pickup			For less chipping		For small size chips

Recommended Work II	Package
Part Number	UHP-1025M3	UHP-1510M3	UHP-1525M3	USP-1515M4	USP-1515MG
基材	PO
颜色	MW
总厚度 (μm)	125	160	175	165
黏着力 (μm)	25	10	25	15
Adhesive Strength (N/20mm)	12.0(0.2)	6.5(0.2)	13.5(0.2)	14.5(0.2)	15.0(0.2)
Probe Tack (N/20mm2)	5.5(0.05)	4.2(0.05)	5.6(0.05)	6.2(0.05)	5.9(0.05)
特性	For encapsulated workpiece For less backside burrs For less glue scratch-up on the chip side walls For less against residue onto a making area

Recommended Work III	Glass Crystal
Part Number	UDT-1025MC	UDT-1325D	UDT-1915MC
基材	PET
颜色	T
总厚度 (μm)	125	155	203
黏着力 (μm)	25		15
Adhesive Strength (N/20mm)	30.0(0.2)	20.4(0.2)	20.3(0.2)
Probe Tack (N/20mm2)	7.5(0.05)	6.7(0.05)	5.9(0.05)
特性	For less backside cracking	For encapsulated workpiece	For less backside cracking

＊( ) is adhesive strength after UV.
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White), T (Transparent)
＊UV irradiate condition : Light volume=above 150mJ/cm2.
＊UV irradiate condition may change with dicing products.
＊Separator thickness is not included.

晶圆切割胶带

信息内容

晶圆切割胶带 - Pressure Sensitive Series -

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.

We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Various product line
● standard type (AD series)
● high-performance to difficult-to-adhere workpiece (ＧＤ series)
● excellent stability against elapsed deterioration (Ｔ series)
● high-performance to laser-dicing (F-90)
● Easy pick-up with excellent expandability

Specification

Recommended Works	Part Number	Base Film	Color	Thickness (μm)	Adhesion Thickness (μm)	Adhesive Strength (N/20mm)	Probe Tack (N/20mm2)	Feature
Si GaAs Other Semiconductor	F-90MW	PO	MW	90	10	1	1	PVC-free type
	T-80MW	PVC		80		0.8	0.7	Excellent temporal stability
	T-80HW			80		1.7	1
	T-120HW			120		1.7	1
Thick Workpiece	20GE-200		LB	200		2.7	2.9	For thick workpiece

＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
＊Separator thickness is not included.

晶圆切割胶带 - UV Series -

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.

Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.

We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Excellent control to back-side chipping and chip fly-off.
● Excellent adhesiveness.
● Smooth peeling by UV.
● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

Recommended Work I	Si GaAs Other Semi conductor
Part Number	UDV- 80J	UDV- 100J	UHP- 110B	UHP- 0805MC	UHP- 1005M3	UHP- 110M3
基材	PVC		PO
颜色	T		MW
总厚度 (μm)	80	100	110	85	105	110
黏着力 (μm)	10			5		10
Adhesive Strength (N/20mm)	3.8(0.2)	3.8(0.2)	2.9(0.2)	5.0(0.2)	5.0(0.2)	7.6(0.2)
Probe Tack (N/20mm2)	2.1(0.05)	2.1(0.05)	2.7(0.05)	1.7(0.05)	2.7(0.05)	3.9(0.05)
特性	Easy pickup			For less chipping		For small size chips

Recommended Work II	Package
Part Number	UHP-1025M3	UHP-1510M3	UHP-1525M3	USP-1515M4	USP-1515MG
基材	PO
颜色	MW
总厚度 (μm)	125	160	175	165
黏着力 (μm)	25	10	25	15
Adhesive Strength (N/20mm)	12.0(0.2)	6.5(0.2)	13.5(0.2)	14.5(0.2)	15.0(0.2)
Probe Tack (N/20mm2)	5.5(0.05)	4.2(0.05)	5.6(0.05)	6.2(0.05)	5.9(0.05)
特性	For encapsulated workpiece For less backside burrs For less glue scratch-up on the chip side walls For less against residue onto a making area

Recommended Work III	Glass Crystal
Part Number	UDT-1025MC	UDT-1325D	UDT-1915MC
基材	PET
颜色	T
总厚度 (μm)	125	155	203
黏着力 (μm)	25		15
Adhesive Strength (N/20mm)	30.0(0.2)	20.4(0.2)	20.3(0.2)
Probe Tack (N/20mm2)	7.5(0.05)	6.7(0.05)	5.9(0.05)
特性	For less backside cracking	For encapsulated workpiece	For less backside cracking

＊( ) is adhesive strength after UV.
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White), T (Transparent)
＊UV irradiate condition : Light volume=above 150mJ/cm2.
＊UV irradiate condition may change with dicing products.
＊Separator thickness is not included.

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